LOCTITE HF 212

Halogen-
free

No-clean

Pb-free

LOCTITE HF 212

Halogen-free, No-clean, Pb-free

Halogen and Pb-free solder paste designed for medium to large boards. Excellent solderability over a wide reflow operating window in both air and nitrogen across a wide range of challenging surface finishes including immersion Ag, OSP copper, ENIG and CuNiZn.

Technical Information

Attributes
Technology
Alloy
90iSC
SAC0307
SAC305
SAC387
Metal Content
88.5%
Particle Size Distribution
Type 3, 4, 4.5 (4A), 5
IPC J-STD-004B Classification
ROL0
Optimal Shelf Life
6 months @ 0 – 10°C

Features And Benefits

  • Excellent fine pitch coalescence
  • Suitable for fine pitch, high speed printing up to 140 mms-1
  • Ideal for appliances, automotive, computing/server, handheld and wireless data infrastructure markets
  • High tack
  • Low voiding
  • Excellent performance after extended abandon and printing times

Technical Data Sheet

Technical Data Sheets (TDS)

LOCTITE HF 212

Performance and technical characteristics of the material

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